 |
Preconference Workshop IEEE CPMT on
The components, packaging and manufacturing
June 25-27, 2014 Taiwan
|
|
 |
|
Theme Of the conference
This 3-day’s workshop with 12 invited speeches incorporates IEEE CPMT Taipei Chapter with a pre-Conference of Optics 2014 to provide student attendees with fundamental, developing and pioneering knowledge in advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.
The components, packaging and manufacturing technologies are the core industry of Taiwan. Training students in the university to acquire knowledge from different sources provided by distinguished experts from academics and industries is the aim of this workshop. This workshop also offers an opportunity for students to recognize, participate and involve the activities of international Conferences.
This workshop would not be possible without the sponsorship from the Advanced Semiconductor Engineering, Inc., Optics 2014, and NSYSU.
|
|
Invited speaker
Yu-Jung Huang Electronic Engineering, I-Shou University
Title: Interconnection technologies for 3D integration
Fan-Tien Cheng Professor National Cheng Kung University Title: VM-based Baseline Predictive Maintenance
Kwang-Lung Lin Professor National Cheng Kung University Title: Interconnects in Electronic Package
Peng-Sheng Wei National Sun Yat-sen University Title: Controlling surface and volumetric defects
Wood-Hi Cheng Professor National Sun Yat-sen University Title: The Art and Science of Packaging High-Coupling Photonics Devices and Modules
Shen-Li Fu I-Shou University, Kaohsiung Title: 3D IC Integration and Packaging
Mei-Ling Wu National Sun Yat-sen University Title: Simulation Assisted Physics of Failure based Reliability Assessment
Kuo-Ning Chiang National Tsing Hua University Title: The Impact of Design-on-Simulation Technology
Lih-Tyng Hwang National Sun Yat-sen University Title: "Quantum Processes in Superconducting-Magnetic Josephson Junctions"
James Sauls Professor Northwestern University, USA Title: An Introduction to Hardware Technology for Mobility: 3D IC and RF SiPs
|
Organizer
Peng-Sheng Wei National Sun Yat-sen University Taiwan
Supporting Journals
|
|
|
|
|