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Preconference Workshop IEEE CPMT on

The components, packaging and manufacturing

June 25-27, 2014 Taiwan
Theme Of the conference
This 3-day’s workshop with 12 invited speeches incorporates IEEE CPMT Taipei Chapter with a pre-Conference of Optics 2014 to provide student attendees with fundamental, developing and pioneering knowledge in advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.
The components, packaging and manufacturing technologies are the core industry of Taiwan. Training students in the university to acquire knowledge from different sources provided by distinguished experts from academics and industries is the aim of this workshop. This workshop also offers an opportunity for students to recognize, participate and involve the activities of international Conferences.
This workshop would not be possible without the sponsorship from the Advanced Semiconductor Engineering, Inc., Optics 2014, and NSYSU.
Invited speaker
Yu-Jung Huang
Electronic Engineering, I-Shou University
Title: Interconnection technologies for 3D integration
Fan-Tien Cheng
Professor National Cheng Kung University
Title: VM-based Baseline Predictive Maintenance
Kwang-Lung Lin
Professor National Cheng Kung University
Title: Interconnects in Electronic Package
Peng-Sheng Wei
National Sun Yat-sen University
Title: Controlling surface and volumetric defects
Wood-Hi Cheng
Professor
National Sun Yat-sen University
Title: The Art and Science of Packaging High-Coupling Photonics Devices and Modules
Shen-Li Fu
I-Shou University, Kaohsiung
Title: 3D IC Integration and Packaging
Mei-Ling Wu
National Sun Yat-sen University
Title: Simulation Assisted Physics of Failure based Reliability Assessment
Kuo-Ning Chiang
National Tsing Hua University
Title: The Impact of Design-on-Simulation Technology
Lih-Tyng Hwang
National Sun Yat-sen University
Title: "Quantum Processes in Superconducting-Magnetic
Josephson Junctions"
James Sauls
Professor
Northwestern University, USA
Title: An Introduction to Hardware Technology for Mobility: 3D IC and RF SiPs
Organizer
Peng-Sheng Wei
National Sun Yat-sen University
Taiwan
Supporting Journals
Media partners
Conference Secretariat:

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